Thin layer deposition
The Thin Film Deposition service of U7, allows the integration of microelectronics in biomedical devices. Having four different deposition sources, being resistive evaporation, electron beam evaporation, DC sputtering and RF sputtering, this is a versatile equipment, due to the wide range of deposition techniques and materials available (Ti, Cr, Cu, Au, Al, ITO, SiOx and AlOx).
Customer benefits
Our Thin Film Deposition service benefits from being part of a bioengineering-specialized research centre, providing wide knowledge in the main applications of these methods and materials in the field of bioengineering. We offer custom services, assuring close and direct interaction with the client, to meet conclusive results and high-quality needs.
Target customer
Our target customers are researchers in the field of bioengineering and microelectronics, or R&D departments of biotech companies which want to test include microelectronics in their biomedical prototypes or devices.
Additional information
Sputtered gold electrodes (100 nm thick), on a cover slip glass substrate. Image given by Dr. Mònica Mir from the “Nanobioengineering group” at IBEC.
